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Home / All / CNC Machining Process & Technology / What should a first-article CMM report include for my Semiconductor manifold & wafer clamp?
What should a first-article CMM report include for my Semiconductor manifold & wafer clamp?
What a buyer should check
For Semiconductor manifold & wafer clamp, the first-article inspection (FAI) report is your baseline for incoming inspection. At LusterControl every new print ships with CMM first-article data backed by 60 CNC machines and in-house turn-mill composite, 5-axis, mirror/electropolishing, Swiss-type turning, lot traceability. For startup / crowdfunded, that measured proof matters more than a supplier's word.
Minimum the report should show
- Actual measured value vs the print tolerance for each critical dimension.
- The datum scheme and measuring equipment used.
- Material cert cross-referenced to the lot.
- Pass or fail against your AQL and the drawing.
Low-moq prototyping and a fast path to first articles - keep the FAI as the reference if a part ever fails in the field.
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